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Poster
CP1
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Ecological Uses of Tourmaline
K. Shigenobu, T. Matsumura, K. Oguri and Y. Nishi
Tokai Univ., JAPAN |
Ecological Alloy of Li-Al
K. Mori, T. Matsumura, T. Okada, Y. Yamaguchi, K. Oguri, T. Yasuoka, S. Mitsuzawa and Y.
Nishi
Tokai Univ., JAPAN |
Effect of Epoxy Resin Coating on Electric Resistance and
Environment-Proofing Character of Woodceramics
T. Azuma1, M. Otsuka1, T. Okabe2 and M. Takayama3
1Shibaura Institute of Technology, 2Industrial Research Institute of
Aomori Prefecture, 3Three Bond Corp., JAPAN |
An Environment-Friendly Lumber-Like Product from Date Palm Leaves'
Midribs
H. I. El-Mously1, M.M. Megahed2 and T.A. Mohammed1
1Ain Shams Univ. 2Alexandria Univ., EGYPT |
Separation of Metallic Particles by a Vertical Vibration for Solid
Waste Treatment
J. Choi1, T. Hayashi2, S. Endoh2 and H. Sakamoto2
1New Energy and Industrial Technology Development Organization, 2National
Institute of Resources and Environment, JAPAN |
CP2
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Inverse Factory for the End-of-Life Cars - Complete Dismantling
System -
H. Yamamoto1, S. Shibata1 and H. Neijenhuis2
1Toyo Engineering Corp., JAPAN, 2VMI EPE Holland BV., THE
NETHERLANDS |
Recycling Technology of Composite Materials
S. Yahagi, K. Oyama and D. Iwasaki
Takuma Co., Ltd., JAPAN |
CP3
|
Soil Recycling at Gas Pipe Construction Site
Y. Fukushima
Tokyo Gas Co., Ltd., JAPAN |
Disassembling and Selective Material Recovering Process of Vacuum
Aided Recycling Systems Technology (VARS Tech.)
Y. Saotome, Y. Nakazawa and T. Ogihara
Gunma Univ., JAPAN |
Possibility of Inverse Manufacturing of Coated Aluminum Products
S. Ohga1, M. Ohga2, Y. Ozu3 and H. Uchida3
1Yamaichi New Technology, 2Yamaichi Metals, 3Tokai Univ.,
JAPAN |
EARTHPORT Tokyo Gas Kohoku New Town Building - An Office Building
with Life-cycle Energy Saving Features -
O. Shibata
Tokyo Gas Co., Ltd., JAPAN |
Energy Consevation in the TEPCO R & D Center
Y. Tsubota
Tokyo Electric Power Company, JAPAN |
CP4
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Sew
H. Noguchi, S. Sato and T. Isogai
Meidensha Corp., JAPAN |
CP5
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Reliability of Sn-Zn-Bi Bonding Formed under Air Reflow
T. Shoji, T. Kuramoto and Y. Kinoshita
Showa Denko K.K., JAPAN |
Effect of Bismuth and Copper on the Creep Properties of Sn-3.5 Ag
Solder Alloy
K. Atsumi, Y. Kariya and M. Otsuka
Shibaura Institute of Technology, JAPAN |
Evaluation of Wetting Properties for Sn-Ag-X System Solder by
Modified Wetting Balance Technique
K. Nakamura, Y. Kariya, S. Funakawa and M. Otsuka
Shibaura Institute of Technology, JAPAN |
Lift-Off Phenomenon in Sn-Bi Alloys and Effect of Alloying
Elements
M. Ueshima, K. Suganuma, I. Ohnaka, J. Zhu, H. Yasuda and M. Takayuki
Osaka Univ., JAPAN |
Toward Defects-Free in Lead-Free Micro-Soldering
T. Takemoto
Osaka Univ., JAPAN |
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