Going@Green@EcoDesign2007
‘ζ‚T‰ρ ŠΒ‹«’²˜aŒ^έŒv‚ΖƒCƒ“ƒo[ƒXEƒ}ƒjƒ…ƒtƒ@ƒNƒ`ƒƒƒŠƒ“ƒO‚ΙŠΦ‚·‚鍑Ϋ‰ο‹c
ƒGƒlƒ‹ƒM[Šλ‹@Žž‘γ‚Ι‚¨‚―‚ιAŽΠ‰οƒVƒXƒeƒ€AƒrƒWƒlƒXν—ͺAŠvV‹Zp‚ΜƒGƒRƒfƒUƒCƒ“‚Ι‚ζ‚铝‡
December 10-13, 2007 in Tokyo, Japan
organized by the Union of EcoDesigners, Japan, under the unified subtitle gGoing Greenh

 

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‘ŽεΓ ƒGƒRƒfƒUƒCƒ“Šw‰ο˜A‡
‘‹€Γ IEEE CS TCEE, USA
CARE Electronics, Europe

  

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‘‘ε‰οˆΟˆυ’· ŽR–{—Ηˆκi“Œ‹ž‘εŠwj
‘‘gDˆΟˆυ•›ˆΟˆυ’·i–k•Δ‘γ•\j Patrick Eagan
Eagan@engr.wisc.edu
‘‘gDˆΟˆυ•›ˆΟˆυ’·i‰’B‘γ•\j Nils Nissen
nissen@5rauhho5en.de
‘International Advisory Board F.Kimura(The University of Tokyo, Japan)
T.Suga(The University of Tokyo, Japan)

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‘ˆΟˆυ’· ΒŽR˜a_i“Œ‹ž‘εŠwj
‘ƒvƒƒOƒ‰ƒ€ˆΟˆυ’· ‘ˆδŒcŽŸ˜Y(ŽY‹Ζ‹Zp‘‡Œ€‹†Š)
‘ƒL[ƒm[ƒgƒ`ƒFƒA ”~“c@–υi‘εγ‘εŠwj

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EcoDesign 2007 Ž––±‹Η
E-mail: ecodesign2007@abegroup.jp